Esec
Datacon 2200 evo
The Datacon 2200 evo is a die bonder for epoxy die attach applications. The Datacon 2200 evo is the 3rd generation of a flexible 300 mm high speed platform. The Datacon 2200 evo has a wafer size range of 4" to 12" on 8" or 12" wafer frames.[1]
Plate 01Besi Datacon 2200 evo and Datacon 8800 Series die bonder /die bonding machine
GEEKVALUE SMT SolutionsWatch on YouTubePlate 02BESI Datacon Die Bonder/bonding machine: datacon 2200 evo/8800 FC Quantum
GEEKVALUE SMT SolutionsWatch on YouTubePlate 03Datacon 2200 EVO Demo Video
Ollie Dunne Tara SemiWatch on YouTubePlate 04datacon 2200 evo besi 2200 evo series die bonder semiconductor equipment machine
GEEKVALUE SMT SolutionsWatch on YouTubePlate 05Datacon 2200 evo
GEEKVALUE SMT SolutionsWatch on YouTube
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec Datacon 2200 evo is a high-speed platform in the Datacon 2200 evo family.[1]
How it works
The Esec Datacon 2200 evo supports epoxy die attach applications and also supports hot and cold processes for epoxy, soldering, thermo-compression, and eutectic work.[1]
The Esec Datacon 2200 evo uses real-time process monitoring, constant status control, and online help functions for production support.[1]
Where it fits in the process flow
The Esec Datacon 2200 evo is positioned for production of package types including QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.[1]
Applications
The Esec Datacon 2200 evo is intended for epoxy die attach applications.[1]
The Esec Datacon 2200 evo supports wafer sizes from 4" to 12" on 8" or 12" wafer frames, die sizes from 0.25 mm to 20 mm, and leadframes with lengths from 90 to 300 mm and widths from 23 to 100 mm.[1]
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options6
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding method does the Esec Datacon 2200 evo use?
The Esec Datacon 2200 evo uses epoxy bonding.[1]
Not publicly documented
The following facts about the Datacon 2200 evo are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Datacon 2200 evo are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Datacon 2200 evo are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Datacon 2200 evo are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Datacon 2200 evo is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Datacon 2200 evo are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 2, 2026.
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