EV Group

6200

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6200 — Inventory photo — Fig. 016200Inventory photo^[1]

What it is

The EVG 6200 is a mask alignment system manufactured by EV Group. The system is available as the EVG 6200 NT, a mask aligner for optical lithography, and as the EVG 6200 BA, an automated bond alignment system. The EVG 6200 NT can be configured as a semi-automated or fully automated tool and supports wafer sizes up to 200 mm.^[2]^[3]

How it works

General reference — not yet source-verified

In operation, the mask and wafer are loaded into the aligner, aligned relative to each other using optical microscopes and alignment keys, and then brought into contact or proximity. Exposure is performed by illuminating the mask with UV light, transferring the mask pattern into the photoresist layer.

Applications

The EVG 6200 NT is applied in the exposure of thin and thick photoresists, patterning of deep cavities and comparable topographies, and processing of thin and fragile materials such as compound semiconductors. The system is used in MEMS production, 3D integration, and other emerging fields that require precise alignment and versatile lithography. The EVG 6200 BA is specified for bond alignment in wafer-to-wafer bonding applications, including temporary bonding and debonding.^[2]^[3]

What do the numbers mean?

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Frequently asked questions

What alignment accuracies are achievable on the EVG 6200 NT?

Top-side alignment accuracy is ≤ ±0.5 µm, bottom-side alignment is ≤ ±1.0 µm, IR alignment is ≤ ±2.0 µm, and bond alignment is ≤ ±2.0 µm. NIL alignment accuracy is ≤ ±3.0 µm.^[2]

What throughput can the fully automated EVG 6200 NT achieve?

In first-print mode the system reaches 180 wafers per hour; in automatic alignment mode it reaches 140 wafers per hour.^[2]

What exposure modes are available?

The system supports vacuum contact, hard contact, soft contact, proximity mode, and flex mode.^[2]

Can the EVG 6200 NT be upgraded from a semi-automated to a fully automated version?

Yes, the system is field upgradeable from the semi-automated to the fully automated configuration.^[2]

Not publicly documented

The following facts about the 6200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No specifications for the 6200 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician