EV Group
Gemini
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The GEMINI is a state-of-the-art, fully automated production wafer bonding system that integrates wafer-to-wafer alignment and bonding processes in a modular design. The GEMINI equipment platform includes up to four bond chambers that ensure excellent bond quality and yield. The GEMINI supports a wide range of processes including metal, anodic, glass-frit, fusion, and adhesive bonding.[1]
What it is
The GEMINI system is an integrated modular platform for aligned wafer bonding. The GEMINI is designed for high-volume manufacturing. The system supports wafer sizes up to 300 mm. The system can include up to four bond chambers. Bond forces reach up to 350 kN. The system is capable of metal, anodic, glass-frit, fusion, and adhesive bonding processes.[1]
A variant of the GEMINI, the GEMINI FB, is specifically designed for fusion bonding. The GEMINI FB features the SmartView NT3 bond aligner. The aligner achieves sub 50 nm wafer-to-wafer alignment accuracy. The GEMINI FB can accommodate up to six pre-processing modules. The GEMINI FB supports wafer diameters of 200 mm and 300 mm.[2]
How it works
The GEMINI system integrates wafer-to-wafer alignment and bonding in a modular design. The GEMINI system uses the SmartView bond alignment system. The bond chambers provide rapid heating and cooling. The system offers optimized temperature uniformity and accurate chamber pressure control. High vacuum and overpressure capabilities are available.[1]
Where it fits in the process flow
General reference — not yet source-verifiedWafer bonding systems are typically employed in the packaging phase of semiconductor manufacturing, after front-end wafer processing. The bonded wafer stack may then undergo thinning, dicing, and final assembly. The GEMINI is designed for production environments.
Applications
The GEMINI system is suited for MEMS manufacturing. The system supports wafer-level vacuum or overpressure encapsulation. The system is also used for advanced system integration.[1]
The GEMINI FB is designed for applications such as memory stacking, 3D systems on chip, backside illuminated CMOS image sensor stacking, and die partitioning.[2]
What do the numbers mean?
Vacuum & pumping2
Wafer handling5
Performance1
Configuration & options7
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| GEMINI FB | — | — | Integrated platform for high precision alignment and fusion bonding; features SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy and up to six pre-processing modules. | evgroup.com[2] |
| GEMINI FB XT | — | — | Extended version that combines higher productivity with improved alignment and overlay accuracy; features XT Frame concept for highest throughput with EFEM. | evgroup.com[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the GEMINI system accommodate?
The 200 mm version handles wafers from 100 mm to 200 mm. The 300 mm version handles wafers from 200 mm to 300 mm. The GEMINI FB also supports 200 mm and 300 mm wafers.[1][2]
What bonding processes are supported by the GEMINI?
The GEMINI supports metal, anodic, glass-frit, fusion, and adhesive bonding.[1]
What is the maximum bond force of the GEMINI?
The 200 mm version has a bond force up to 100 kN. The 300 mm version has a bond force up to 350 kN.[1]
What alignment accuracy does the GEMINI FB provide?
The GEMINI FB features a SmartView NT3 bond aligner with sub 50 nm wafer-to-wafer alignment accuracy.[2]
How many bond modules can the GEMINI include?
Both the 200 mm and 300 mm versions can include up to four bond modules.[1]
Not publicly documented
The following facts about the Gemini are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gemini are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Gemini are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Gemini are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Gemini is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Gemini are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]evgroup.com — evgroup.comevgroup.com
- [3]Equipment inventory listing
Last updated Oct 2, 2026.
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