Lam Research
2300 Exelan Flex
The Lam 2300 Exelan Flex is an etch chamber for semiconductor wafer processing. The Lam 2300 Exelan Flex is designed for 300 mm (12 inch) wafers.[1][2]
What it is
How it works
General reference — not yet source-verifiedA plasma etch system contains a vacuum chamber that holds the wafer on a support. Process gases are introduced into the chamber through a gas inlet. Radio-frequency power applied to electrodes ionizes the gas into a plasma. The plasma reacts with exposed films on the wafer, removing them to form the desired pattern.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the Lam 2300 Exelan Flex support?
The Lam 2300 Exelan Flex supports wafers with a 12-inch diameter.[1]
What are the electrical specifications of the Lam 2300 Exelan Flex?
The Lam 2300 Exelan Flex operates on 208 VAC at 50/60 Hz, with a full load current of 56 A and a main circuit breaker rating of 70 A.[3]
Not publicly documented
The following facts about the 2300 Exelan Flex are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Exelan Flex are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 Exelan Flex are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 Exelan Flex are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 Exelan Flex are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2300 Exelan Flex is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]CN101131928A - Triple Resist Organic Layer Etching - Google Patents — patents.google.compatents.google.com
Last updated Oct 3, 2026.
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