Lam Research
9600
The Lam 9600 is an 8-inch etch system. The Lam 9600 uses Envision Software and includes a Hine Cassette Indexer for load/unload. The Lam 9600 main chamber is configured with a bottom actuated clamping system, an Adixen Alcatel ATH 1300 turbo pump, and RPG 1250 RF generators.[1][2]
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Power
208 V[1]
Vacuum
Adixen Alacatel ATH 1300 Turbo Pump[1]
Gas delivery
Gas Box Configured for 6 Gasses[1]
What it is
General reference — not yet source-verifiedThe Lam 9600 is a single-wafer plasma etch system used in semiconductor manufacturing for removing material from wafer surfaces through reactive ion etching.
How it works
The Lam 9600 uses a bottom-actuated clamping system to hold the wafer in the main etch chamber. The main chamber is equipped with an Adixen Alcatel ATH 1300 turbo pump and a VAT 65 throttle valve to maintain process vacuum. A gas box configured for six gases supplies process chemistry to the chamber.[1]
Reactive ion etching is driven by RPG 1250 RF generators that create a plasma from the process gases. The DSQ (downstream) / exit load lock is configured for three gases and includes a heated paddle. An atmospheric passivation module (APM) and a WVDS (wafer vapor deposition system) are present for passivation steps.[1][2]
What do the numbers mean?
Power & electrical3
- RPG 1250 RF Generators[1]
Vacuum & pumping2
- Adixen Alacatel ATH 1300 Turbo Pump[1]
Wafer handling8
Gas & chemistry3
Control & software2
- Envision Software[1]
Configuration & options13
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage208 V[1]
- ConfigurationAdixen Alacatel ATH 1300 Turbo Pump[1]
- ConfigurationGas Box Configured for 6 Gasses[1]
- ConfigurationRPG 1250 RF Generators[1]
- ConfigurationConfigured for 3 Gases[1]
- Main Chamber Turbo PumpAdixen Alcatel ATH 1300[1]
- Main Chamber Gas Configuration6 Gasses[1]
- Main Chamber RF GeneratorsRPG 1250[1]
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of materials can this class of etch system remove?General reference — not yet source-verified
Plasma etch systems are capable of removing a broad range of materials, including silicon, silicon dioxide, silicon nitride, aluminum, copper, and various low-k dielectrics. The specific chemistry and process conditions are tailored to the material being etched.
How is etch uniformity controlled across the wafer?General reference — not yet source-verified
Uniformity is managed through hardware design (e.g., gas distribution systems, electrode temperature control) and process parameters (e.g., pressure, gas flow ratios). Many etch systems incorporate multi-zone heating or cooling to maintain consistent etch rates from center to edge.
Can this type of etch system be used for both conductor and dielectric etching?General reference — not yet source-verified
Yes, many plasma etch platforms are designed to handle both conductor and dielectric materials by switching between appropriate gas chemistries and hardware configurations. However, certain systems are optimized for one class of materials and may require modification for the other.
What is a typical maintenance schedule for such etch equipment?General reference — not yet source-verified
Routine maintenance includes periodic cleaning of the chamber walls and electrode surfaces, replacement of consumable parts such as O-rings and dielectric windows, and recalibration of gas delivery and RF matching networks. Intervals depend on usage and process chemistry but are typically measured in processing hours or wafer counts.
Not publicly documented
The following facts about the 9600 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9600 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 9600 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 9600 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9600 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9600 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]manualslib.commanualslib.com
- [5]semigroup.comsemigroup.com
- [6]semistarcorp.comsemistarcorp.com
Last updated Oct 11, 2026.
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