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LTX-Credence

PAX

Test & ProbeLTX-Credence PAX family
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The LTX-Credence PAX is a semiconductor tester in the test and probe category. The PAX tester includes modules such as SSBA, OVI, HCOVI, AWG_HSB, DIG_HB, DDP_PIN, DDP_SEQ, and XRF.[1][2]

PAX — Inventory photo
Fig. 01PAXInventory photo[2]

What it is

The LTX-Credence PAX is a tester in the test and probe category.[1][3]

How it works

General reference — not yet source-verified

A test and probe system evaluates semiconductor devices by making electrical contact through probes and routing signals through test instrumentation.

A tester in this class commonly supports measurement, signal generation, and device interfacing so that devices can be exercised under controlled test conditions.

Where it fits in the process flow

General reference — not yet source-verified

A test and probe system sits in wafer test and device characterization flows before final packaging or downstream assembly steps.

A tester in this class is used where electrical verification, probing, and measurement are needed to sort, characterize, or validate devices at the wafer level.

Applications

The PAX family is placed in the test and probe category for semiconductor testing.[1][3]

What do the numbers mean?

Configuration & options18

SSBA
1[2]
Accurate?
OVI
1[2]
Accurate?
HCOVI
1[2]
Accurate?
AWG_HSB
1[2]
Accurate?
DIG_HB
1[2]
Accurate?
DDP_PIN
1[2]
Accurate?
DDP_SEQ
1[2]
Accurate?
XRF
1[2]
Accurate?
Equipment type
tester[2]
Accurate?
Modules listed
SSBA, OVI, HCOVI, AWG_HSB, DIG_HB, DDP_PIN, DDP_SEQ, XRF[2]
Accurate?
SSBA count
1[2]
Accurate?
OVI count
1[2]
Accurate?
HCOVI count
1[2]
Accurate?
AWG_HSB count
1[2]
Accurate?
DIG_HB count
1[2]
Accurate?
DDP_PIN count
1[2]
Accurate?
DDP_SEQ count
1[2]
Accurate?
XRF count
1[2]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

How does the tester interface with the device?General reference — not yet source-verified

The test head contains a precision interface board (commonly called a DIB, device interface board) that routes signals to a set of spring-loaded probes or a socket. For wafer probing, the DIB mates with a prober’s chuck; for packaged parts, it mates with a handler that inserts devices into the socket.

What is the typical test cycle for a device on such a system?General reference — not yet source-verified

A test cycle consists of aligning the device to the contactor, lowering the head to make electrical contact, executing a test program that applies voltages and patterns, measuring the response, and then lifting the head. The sequence repeats for each device at a rate that depends on the test complexity and the parallelism of the system.

Can these testers be used for device characterization as well as production test?General reference — not yet source-verified

Yes, machines of this class support both characterization and production test. Characterization uses more exhaustive test sequences and detailed data logging to understand device behavior, while production test uses a streamlined subset of tests for high-throughput pass/fail screening.

Not publicly documented

The following facts about the PAX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAX are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the PAX are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the PAX are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PAX are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PAX is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]PAX — LTX-Credence | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
  2. [2]Inventory photo
  3. [3]LTX-Credence PAX family | Waferpedia — waferpedia.comwaferpedia.com
  4. [4]LTX-Credence | an Xcerra Company — www2.ltxc.com (Nov 2, 2016)web.archive.org
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Last updated Oct 5, 2026.

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