Waferpedia

Nanoscribe

Photonic Professional GT

The Nanoscribe Photonic Professional GT+ is a 3-dimension (3D) nanoprinter that uses two-photon absorption from an infrared (780 nm) femtosecond laser to expose and polymerize UV-sensitive photoresists. The highest resolution of the Nanoscribe Photonic Professional GT+ is below 200 nm lateral dimensions, achieved with the 63x objective in dip-in laser lithography (DILL) mode.[1]

Photonic Professional GT — epfl.ch
Fig. 01Photonic Professional GTepfl.ch[1]

Wafer size

4"

Performance

lower than 1.5 µm[1]

Optics

780 nm[1]

What it is

The Nanoscribe Photonic Professional GT is a two-photon laser lithography system for three-dimensional microfabrication and nanofabrication. The system writes polymer structures from CAD-derived files and supports maskless direct writing of complex three-dimensional features.[3][4][2]

How it works

The system uses two-photon polymerization with an infrared femtosecond laser to expose photoresist at the focal point. The focused beam induces polymerization only where the local intensity is high enough, which confines exposure to a small voxel inside the resist.[1][2][4]

The system combines a piezoelectric scanning stage with galvo-mirror beam steering. The piezo stage moves the substrate relative to the focus for high-precision placement, and the galvo mirrors deflect the focus laterally for faster scanning over larger regions.[4][2]

Where it fits in the process flow

The system sits in the lithography part of the microfabrication flow as a direct-write tool. The substrate is prepared with a suitable photoresist, the print file is loaded, the stage is aligned to the sample, and the structure is written before downstream development and cleaning steps.[2]

Applications

The system is used for optics, plasmonics, microfluidics, sensors, micro-robotics, biomimetics, and life-science structures. The tool is also used for micro- and nanoscale parts that require complex three-dimensional polymer geometry.[2][4][3]

The system uses UV-curable photoresists and supports direct laser writing with conventional and dip-in laser lithography modes. The available resist families include IP-Dip, IP-S, IP-Q, IP-Visio, and related formulations named for use with specific objectives and print modes.[2][1][3]

  • two-photon polymerization
  • photopolymerization of UV-sensitive photoresists
  • DILL writing
  • alignment on existing wafer/sample topography

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • The objectives are described as extremely sensitive and expensive.
  • The equipment is described as sensitive to vibrations.

What do the numbers mean?

Power & electrical1

Laser type
780 nm femtosecond fiber laser, 120 mW, 150 fs pulse duration, 80 MHz repetition rate, Class 3[2]
Accurate?

Wafer handling7

Standard substrates
quartz, silicon, ITO-coated glass, 170 µm-thick borosilicate, microscope slides up to 26 x 76 mm, 4 inch wafers, 2 inch wafers[1]
Accurate?
Sample formats
25x25 mm² fused-silica, ITO-coated glass, silicon; 30 mm borosilicate; microscope slides up to 26x76 mm²; 4-inch and 2-inch wafers, thickness 350-550 µm[1]
Accurate?
Substrates
25x25 mm fused silica, ITO-coated glass, silicon, 30 mm borosilicate, microscope slides, 4-inch and 2-inch wafers[1]
Accurate?
Alignment option
Available on existing wafer/sample topography[1]
Accurate?
Standard substrates
quartz or silicon; ITO-coated glass or silicon; silicon[1]
Accurate?
Listed sample holders and substrates
25 x 25 mm² fused-silica substrate, 25 x 25 mm² ITO-coated glass substrate, 25 x 25 mm² silicon substrate, ∅ 30 mm thin borosilicate substrate, microscope slides up to 26 x 76 mm², 4 inch wafers, and 2 inch wafers[1]
Accurate?
Sample holders
4 inch wafers, thickness between 350 and 550 um[1]
Accurate?

Gas & chemistry1

Photoresist compatibility
UV-sensitive photoresists including standard i-line photoresists[1]
Accurate?

Optics & imaging36

Laser wavelength
780 nm[1]
Accurate?
Laser type
femtosecond laser[1]
Accurate?
Objectives
20x (air), 10x (immersion), 25x (immersion), 63x (immersion)[1]
Accurate?
63x objective resolution
< 200 nm lateral dimensions; < 700 nm z-height[1]
Accurate?
25x objective resolution
< 600 nm x-/y- diameter; < 2 µm z-height[1]
Accurate?
10x objective resolution
< 1.2 µm x-/y- diameter; < 6 µm z-height[1]
Accurate?
20x objective resolution
< 800 nm x-/y- diameter; < 5 µm z-height[1]
Accurate?
High-resolution mode objective
63x NA1.4, 360 µm working distance[1]
Accurate?
Micro- to mesoscale mode objective
25x NA0.8, 380 µm working distance[1]
Accurate?
FAST macroscale mode objective
10x NA0.3, 700 µm working distance[1]
Accurate?
Laser
Infrared femtosecond laser, 780 nm[1]
Accurate?
Resolution (lateral)
< 200 nm (with 63x objective)[1]
Accurate?
Resolution (vertical)
< 700 nm (with 63x objective)[1]
Accurate?
Max write area (block-free field)
1000 µm (with 10x objective)[1]
Accurate?
Max structure volume
~10 mm³ (FAST macroscale mode, 10x objective)[1]
Accurate?
Pattern generation software
Describe (slicing/hatching, converts .STL to exposure jobs)[1]
Accurate?
Resolution (63x immersion)
Lateral <200 nm, axial <700 nm[1]
Accurate?
Resolution (25x immersion)
Lateral <600 nm, axial <2 µm[1]
Accurate?
Resolution (10x immersion)
Lateral <1.2 µm, axial <6 µm[1]
Accurate?
Resolution (20x air)
Lateral <800 nm, axial <5 µm[1]
Accurate?
Writing modes
Dip-in laser lithography (DiLL), direct laser writing (DLW)[1]
Accurate?
Laser type
Infrared femtosecond laser at 780nm[1]
Accurate?
Exposure mechanism
Two-photon absorption[1]
Accurate?
Objective magnifications
20x (air), 10x (immersion), 25x (immersion), 63x (immersion)[1]
Accurate?
Highest resolution
< 200nm lateral dimensions (with 63x objective)[1]
Accurate?
High resolution mode (3D SF) objective
63x NA1.4, 360um working distance, block-free printing field Ø 200 µm[1]
Accurate?
Micro- to mesoscale mode (3D MF) objective
25x NA0.8, 380um working distance, block-free printing field Ø 400 µm[1]
Accurate?
FAST macroscale mode (3D LF) objective
10x NA0.3, 700um working distance, block-free printing field Ø 1000 µm[1]
Accurate?
Exposure method
two-photon absorption[1]
Accurate?
High-resolution mode objective
63x NA1.4, 360 um working distance[1]
Accurate?
High-resolution mode block-free printing field
200 µm diameter[1]
Accurate?
Micro- to mesoscale mode objective
25x NA0.8, 380 um working distance[1]
Accurate?
FAST macroscale mode objective
10x NA0.3, 700 um working distance[1]
Accurate?
Laser type
infrared femtosecond laser[1]
Accurate?
Objective specifications
63X immersion, 25X immersion, 10X immersion, and 20X for air[2]
Accurate?
Galvo scanning
ultrafast galvo-mirrors scan the laser focal point in x- and y-directions[1]
Accurate?

Performance3

Coarse stage precision
lower than 1.5 µm[1]
Accurate?
Coarse stage precision
<1.5 µm[1]
Accurate?
Coarse stage precision
Precision lower than 1.5µm[1]
Accurate?

Control & software3

Software
Describe (slicing/hatching), Nanowrite (operation)[1]
Accurate?
Software
Describe (slicing/hatching software)[1]
Accurate?
Software
Describe[1]
Accurate?

Dimensions & facilities1

Maximum structure height (various modes)
10x DILL (IP-Q): 8 mm; 25x DILL (IP-S): 3 mm; 63x DILL (IP-Dip): 3 mm; Oil immersion (63x, 170 µm glass): 150 µm[3]
Accurate?

Configuration & options19

Machine type
3D nanoprinter[1]
Accurate?
Process
two-photon absorption[1]
Accurate?
Piezo-stage travel range
300 µm in all directions[1]
Accurate?
Stage travel (piezo)
300 µm in all directions[1]
Accurate?
Piezo stage travel
300 µm in all directions[1]
Accurate?
Motorized XY stage range
100 x 100 mm[2]
Accurate?
Photoresists
IP-Dip2, IP-S, IP-Q, IP-Visio, IP-PDMS, IPX-Q, IPX-Clear[1]
Accurate?
File formats
STL, DXF, GWL[1]
Accurate?
Scanning methods
PiezoScan mode (piezo-stage) and GalvoScan mode (galvo-mirrors)[1]
Accurate?
Voxel aspect ratio
Oval shape, typical aspect ratio (z-/x- axis) of about 3.5[1]
Accurate?
Supported input format
CAD-generated 3D structure with .STL format[1]
Accurate?
Tilt-correction option
Available (piezo-scan mode only)[1]
Accurate?
Tool type
3D nanoprinter[1]
Accurate?
Micro- to mesoscale mode block-free printing field
400 µm diameter[1]
Accurate?
FAST macroscale mode block-free printing field
1000 µm diameter[1]
Accurate?
Process
two-photon polymerization[1]
Accurate?
File format
STL[1]
Accurate?
Job code
GWL[1]
Accurate?
Supported materials
UV-sensitive photoresists, including standard i-line photoresists[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Photonic Professional GT+——The source describes GT+ as the model with multiple objectives, DILL configurations, oil-immersion options, and Describe software support.epfl.ch[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Laser type780 nm femtosecond fiber laser, 120 mW, 150 fs pulse duration, 80 MHz repetition rate, Class 3[2]
  • Photoresist compatibilityUV-sensitive photoresists including standard i-line photoresists[1]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What is the laser source wavelength of the Nanoscribe Photonic Professional GT?

The system uses a 780 nanometer femtosecond laser.[1][2]

What is the minimum feature size achievable?

With the 63x immersion objective, lateral dimensions below 200 nanometers can be achieved, and the minimum feature size is approximately 150 nanometers in X-Y and 800 nanometers in Z.[1][3]

Which photoresists are commonly used with the system?

Common photoresists include IP-Dip2, IP-S, IP-Q, IP-Visio, IP-PDMS, IP-L, and IPX formulations.[1][3][2]

What software is required to generate exposure jobs?

The Describe software is used to convert STL files into GWL code for printing.[1][2]

What are the main printing modes?

Printing can be performed using direct laser writing (DLW) or dip-in laser lithography (DiLL), with modes optimized for high resolution (3D SF), micro- to mesoscale (3D MF), and fast macroscale (3D LF).[1][2]

Not publicly documented

The following facts about the Photonic Professional GT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Photonic Professional GT are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Photonic Professional GT are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the Photonic Professional GT is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Photonic Professional GT are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]epfl.ch — epfl.chepfl.ch
  2. [2]ncf.uic.edu — ncf.uic.eduncf.uic.edu
  3. [3]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
  4. [4]Tool Details - Harvard CNS — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
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Last updated Oct 8, 2026.

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