Panasonic
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The Panasonic E 748 SC Dry is a dry etcher. The Panasonic E 748 SC Dry processes 8-inch wafers.[1][2]
The Panasonic E 748 SC is a dry etcher that supports 8-inch wafers.[1]
Dry etching involves introducing reactive gases into a low-pressure vacuum chamber and exciting them into a plasma using radio frequency or microwave energy. The ionized species chemically react with the surface material to form volatile byproducts that are pumped away. The process can be highly directional when an electric field is applied, allowing for anisotropic etching.
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The following facts about the E 748 SC Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the E 748 SC Dry are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the E 748 SC Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the E 748 SC Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the E 748 SC Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the E 748 SC Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 27, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.