Perkin Elmer

The Perkin Elmer 6164 is a sputtering system used for metal deposition.[1]
The Perkin Elmer 6164 is configured for 6 inch wafers.[1]
A sputtering system deposits a thin film by ejecting material from a target and condensing that material onto a wafer surface in a vacuum chamber.
Sputtering systems use process gases and pumped exhaust to sustain the deposition environment and remove byproducts from the chamber.
The Perkin Elmer 6164 belongs in the thin-film deposition stage of semiconductor processing.
The Perkin Elmer 6164 can be used after wafer preparation and before later patterning or integration steps that rely on a deposited metal layer.
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The following facts about the 6164 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6164 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6164 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6164 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6164 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6164 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 9, 2026.
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