Plasma-Therm
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The Plasma-Therm Dual SLR ICP is an inductively coupled plasma etcher.[1]
The Plasmatherm Dual SLR is an inductively coupled plasma (ICP) etcher used for dry etching in semiconductor manufacturing.[1]
ICP etchers are placed in the dry etch module of a semiconductor fab, typically after lithographic patterning. The machine removes material from unmasked areas of a substrate, transferring the photoresist pattern into the underlying film. Etched wafers then proceed to resist strip and cleaning steps before further deposition or lithography cycles.
ICP etchers are used to etch a wide range of materials including silicon, silicon dioxide, silicon nitride, metals, and compound semiconductors. Common applications include gate stack etching, contact hole formation, damascene trench etching, and through-silicon via (TSV) etching. The high density and low pressure of the ICP plasma enable deep, anisotropic etching with minimal damage.
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The model is Dual SLR.[1]
The following facts about the Dual SLR ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Dual SLR ICP are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Dual SLR ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Dual SLR ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Dual SLR ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Dual SLR ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 29, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.