Plasma-Therm

The Plasma-Therm Unaxis 790 RIE is a reactive ion etcher used for semiconductor etch processing.[1]
A reactive ion etcher uses a plasma to remove material from exposed areas of a wafer surface. The process combines chemical reaction with ion-assisted directionality to shape etched features.
A reactive ion etcher sits in the pattern-transfer portion of semiconductor fabrication. The tool transfers lithographic patterns into a film or substrate after a mask or resist has defined the areas to be opened.
Reactive ion etchers are used for anisotropic dry etching of semiconductor films and patterned layers. The class is used where controlled feature transfer and directional etch profiles are needed.
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The following facts about the Unaxis 790 RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unaxis 790 RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Unaxis 790 RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Unaxis 790 RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Unaxis 790 RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Unaxis 790 RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 6, 2026.
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