SUSS MicroTec
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The SUSS MicroTec MA1006 is a manual mask aligner for top and bottom side alignment. The MA1006 offers exposure programmes for proximity, soft, hard and vacuum contact, and is suitable for wafers up to 150mm diameter. The Karl Suss MA1006 achieves 1 micron resolution on 6-inch wafers.[1][2]
The MA1006 supports several exposure modes including proximity, soft contact, hard contact, vacuum contact, and bond mode. In proximity mode, the wafer and mask are separated by a gap adjustable in 1 μm steps. In soft contact, a low contact pressure is applied during exposure. In hard contact, nitrogen pressure beneath the wafer presses it against the mask. In vacuum contact, the space between wafer and mask is evacuated to achieve intimate contact. The exposure lamp can be 350 W, 500 W, or 1000 W, providing UV light in the UV400 or UV300 spectral ranges. The illumination uniformity over a 6-inch wafer is typically ±5%.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MA1006 TSA | — | — | Top Side Alignment variant | nanofab.utah.edu[5] |
| MA1006 TSAIBSA | — | — | Top and Bottom Side Alignment variant | nanofab.utah.edu[5] |
| MA1006 TSAII R | — | — | Variant designation as stated in manual | nanofab.utah.edu[5] |
| MA1006 TSA / BSA | — | — | Top and bottom side alignment configuration | nanofab.utah.edu[1] |
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The MA1006 can process wafers up to 150 mm in diameter.[1]
The MA1006 supports proximity, soft contact, hard contact, vacuum contact, and bond mode.[5][1]
The MA1006 can be equipped with 350 W, 500 W, or 1000 W exposure lamps.[1]
Alignment is performed using micrometer screws for X, Y, and theta directions. For top-side alignment, a splitfield microscope is used; for bottom-side alignment, a CCD camera and digital image storage system are employed.[5]
The illumination uniformity over a 6-inch wafer is typically ±5%.[1]
With Shipley 1813 photoresist under a defined process (2000 rpm spin, 110 °C bake, 30 mJ/cm² exposure, AZ 1:1 develop), the measured minimum linewidth at full photoresist height is 2 μm.[4]
The following facts about the MA1006 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA1006 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MA1006 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA1006 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA1006 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MA1006 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 11, 2026.
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