SUSS MicroTec
PA 200
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS PA 200 is a semi-automatic wafer prober used for precision semiconductor wafer testing and electrical measurement. The SUSS PA 200 is manufactured in the United States, operates at 400 VA, 110 V, and 60 Hz, and has dimensions of 54 x 32 x 32 inches with a weight of approximately 163.29 kg.[1][2]
What it is
General reference — not yet source-verifiedThe SUSS MicroTec PA 200 is a wafer prober used for semiconductor test and probe work.
How it works
General reference — not yet source-verifiedA wafer prober positions electrical probes onto specific sites on a wafer so test signals can be applied and measured at wafer level.
Wafer probing is commonly part of electrical test and inspection before die singulation and later assembly steps.
Where it fits in the process flow
General reference — not yet source-verifiedThe PA 200 fits in wafer-level electrical test and metrology workflows.
The PA 200 can support probe-based characterization before downstream packaging, assembly, or further device evaluation.
Applications
The PA 200 is used for semiconductor wafer testing and electrical measurement.[1]
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the PA 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PA 200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PA 200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PA 200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PA 200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PA 200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]questpair.com — questpair.comquestpair.com
- [2]SUSS MicroTec PA 200 SemiAutomatic Prober for Wafer Testing with Advanced Features - #BB3374764 - #47106 | REUZEit — reuzeit.comreuzeit.com
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]SUSS MicroTec: Device Bonder Express N 1 — suss.com (Aug 30, 2002)web.archive.org
- [7]Equipment inventory listing
Last updated Oct 11, 2026.
