Tegal
803
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedAn RF plasma etcher creates a glow discharge by applying radio-frequency power to a process gas at low pressure. The resulting plasma contains ions, electrons, and radicals that react with the wafer surface to etch patterns defined by a mask.
In an inline automatic system, wafers are loaded from a cassette, processed in sequence through a series of chambers or stations, and then unloaded automatically, allowing high-throughput operation.
Where it fits in the process flow
General reference — not yet source-verifiedPlasma etching is a pattern-transfer step that follows photolithography in semiconductor fabrication. The etcher removes material from areas not protected by photoresist or a hard mask, transferring the circuit pattern into the underlying layer.
Applications
General reference — not yet source-verifiedPlasma etchers are used to etch silicon, silicon dioxide, silicon nitride, and various metals (e.g., aluminum, tungsten) in the manufacture of integrated circuits and microelectromechanical systems.
The Tegal 803, as an RF plasma etcher, would be applicable to both front-end-of-line (FEOL) and back-end-of-line (BEOL) etching processes, including polysilicon gate etching, contact hole formation, and metal interconnect patterning.
- Plasma etching
What do the numbers mean?
Power & electrical1
Wafer handling1
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Tool typeInline automatic wafer RF plasma etcher[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 803 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 803 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 803 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 803 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 803 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 803 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
Last updated Oct 3, 2026.
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