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Tokyo Electron

TE 8500 PESC Dry

EtchTokyo Electron TE 8500 family
Research Quality: 40% complete

The Tokyo Electron TE 8500 PESC Dry is a dry etcher with one chamber. The TE 8500 PESC Dry performs oxide etch with endpoint capability. The TE 8500 PESC Dry uses process gases CF4, CHF3, and He.[1][2]

Tokyo Electron logo
Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

Vacuum

2ea, Ebara, A30W[1]

Gas delivery

CF4, CHF3, He[1]

What it is

The Tokyo Electron TE 8500 PESC Dry is a dry etcher with one chamber.[2][1]

How it works

The Tokyo Electron TE 8500 PESC Dry performs oxide etch with endpoint capability.[2][1]

The Tokyo Electron TE 8500 PESC Dry uses an EPROM-based system and includes two loaders from Fortrend and two Ebara A30W pumps.[2][1]

Where it fits in the process flow

General reference — not yet source-verified

The Tokyo Electron TE 8500 PESC Dry sits in the pattern transfer portion of wafer processing, after a film has been deposited and patterned by lithography.

The Tokyo Electron TE 8500 PESC Dry removes oxide selectively as part of dry etch processing before later fabrication steps continue.

Applications

The Tokyo Electron TE 8500 PESC Dry is configured for oxide etch with endpoint control.[2][1]

The Tokyo Electron TE 8500 PESC Dry uses CF4, CHF3, and He as process gases.[2][1]

What do the numbers mean?

Vacuum & pumping2

OS: EPROM based system - LD: 2ea, Fortrend - Pump: 2ea, Ebara, A30W[1]
Accurate?
Pumps
2ea, Ebara, A30W[1]
Accurate?

Wafer handling1

Loaders (LD)
2ea, Fortrend[1]
Accurate?

Gas & chemistry2

Gas
CF4, CHF3, He[1]
Accurate?
Process gases
CF4, CHF3, He[1]
Accurate?

Control & software1

Operating system (OS)
EPROM based system[1]
Accurate?

Configuration & options6

1 chamber[1]
Accurate?
Oxide etch with end point[1]
Accurate?
Process type
Dry etcher[2]
Accurate?
Number of chambers
1 chamber[1]
Accurate?
Process application
Oxide etch with end point[1]
Accurate?
Listed unit vintage
1996[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • GasCF4, CHF3, He[1]
  • ConfigurationOS: EPROM based system - LD: 2ea, Fortrend - Pump: 2ea, Ebara, A30W[1]
  • Process gasesCF4, CHF3, He[1]
  • Pumps2ea, Ebara, A30W[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the TE 8500 PESC Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TE 8500 PESC Dry are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the TE 8500 PESC Dry are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the TE 8500 PESC Dry are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the TE 8500 PESC Dry are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the TE 8500 PESC Dry is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 7, 2026.

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