Trion
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The Trion Apollo is a photoresist stripping and ashing system used in semiconductor manufacturing for the removal of photoresist layers after lithography and etching steps. The system is designed as a compact production tool that can handle a range of wafer sizes from 100 mm to 300 mm.[1][2]
The Apollo incorporates either an inductively coupled plasma (ICP) source or a microwave source, depending on the application requirements. The system is intended for use in production fabs, pilot lines, and research environments where high-rate, low-damage resist removal is needed.[1][2]
A production-proven multi-axis atmospheric robot with two- or three-link arms provides wafer handling within the system, supporting wafers from 150 mm to 300 mm. The process controller is a PC-based system with graphical software that creates recipes in block-diagram form, stored on 3.5-inch disks. The overall dimensions of the single-chamber system are 18 inches wide by 50 inches deep by 51 inches high.[3]
The Trion Apollo is applied to photoresist descum and stripping in semiconductor fabrication, including removal of hardened or difficult-to-remove resist layers at low temperatures using RF bias power. The system can achieve etch rates up to 6 micrometers per minute and is suitable for high-throughput production environments.[1][2]
Applications include MEMS device fabrication, compound semiconductor processing, and pilot-line production. The system supports wafer sizes from 100 mm to 300 mm and can be equipped with either ICP or microwave plasma sources to match different process requirements.[1][2]
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The Apollo supports wafers from 100mm to 300mm. The robot transports 150mm, 200mm, and 300mm wafers.[1][2][3]
The Apollo can incorporate either a microwave source (SST-Lightning) or inductively coupled plasma (ICP) technology.[1][2]
Yes, the Apollo has an electrostatic chuck with helium backside cooling.[3]
The following facts about the Apollo are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Apollo are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Apollo are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Apollo are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Apollo are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Apollo is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 26, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.