Plasma-Therm

Wafer size
Brooks TM (Transfer Module) with four Wafer Manual Load Lock
Power
208V, 60 Hz, 3 phase[1]
Vacuum
No pumps or chiller included[1]
The Plasma-Therm Versaline VLN ICP has a single ICP chamber and a manual load lock for single or multiple wafers.[1][2]
The Plasma-Therm Versaline VLN ICP includes RF power delivery, gas flow control, pressure control, vacuum pumping, backside cooling, a chamber heater, and a Windows based operating system.[1][2]
Plasma etch tools sit in the pattern transfer part of semiconductor processing and act after lithography has defined features in a masking layer.
Plasma etch tools are used before downstream cleaning, inspection, and later process modules that follow feature transfer into the wafer.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Versaline VLN ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Versaline VLN ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Versaline VLN ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Versaline VLN ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Versaline VLN ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Versaline VLN ICP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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