Resist Processing

The Solitec 5110 C is a photoresist spin coater for wafers, masks, and substrates.

Brewer Science CEE 200 XD Spay / Puddle Developer is a spay/puddle developer with a heated hotplate, chemical delivery and control chassis, and a multi-channel power supply.

The Tokyo Electron Lithius G 260616 is a semiconductor manufacturing tool designed for 12-inch (300mm) wafers.

The Laurell WS-750Lz-23B is a spin coater in the 750 Series. The Laurell WS-750Lz-23B has a maximum substrate size of ø150mm (5" x 5") and a maximum speed of 12,000 rpm.

The Brewer Science 300 X Spin Coater is a spin coater with a heavy duty drive and 208-240 V operation.

The Lam / Novellus / Gasonics Gamma 2130 is a photoresist stripper with source-described system and process chamber configurations.

The SUSS MicroTec Delta 12 AQ is an automated photoresist developer station that supports temperature controlled spray photoresist development.

The Tegal Plasmaline 411 is a plasma asher listed among Tegal plasma processing equipment and parts. The Tegal Plasmaline 411 is associated in the source text with asher, plasma oven, and AR O2 etcher descriptions.

The SUSS Delta 80 Spin is a spin coater/developer with a 3 phase + N + PE, 400 V, 50 Hz power specification and no software included.

The SVG 8626 is a 6-inch cassette-to-cassette photoresist coater with a 2-coat configuration and pumps excluded.

The SUSS RC 5 is a spin coater.

The SUSS Falcon is a wafer backside rinse developer system configured for 6-inch to 8-inch wafers.

Brewer Science CEE 1100 Large Substrate and Wafer Hot Plate accommodates 8-inch wafers and is specified at 220 V and 2000 W.

The Tokyo Electron MK 7 S is an 8-inch coater/developer.

The SUSS RC 8 is a spin coater.

The Lam / Novellus Concept Three Gamma 2130 Photoresist Stripper is a photoresist stripper.

Headway 1 EC 101 R 485 is a photoresist spinner with stated vacuum and electrical requirements.

Specialty Coating Systems (SCS) PC Spray Coater.

The Lam / Novellus / Gasonics PEP 3510 Plus is an asher/stripper for 8-inch wafers.

The Tokyo Electron Certas RST is a dry etcher process chamber used in semiconductor manufacturing.

The Hitachi HS 9050 is an asher with a 12-inch wafer size and a multi-chamber configuration.

The TEGAL 211 is a table top plasma etcher/asher for up to 3-inch wafers with an aluminum chamber.

Tokyo Electron Act 12 DUV Photoresist Coater / Developer Track is a deep ultraviolet wafer-processing system with a right-to-left wafer flow and 300mm wafer setup.

The SUSS MicroTec RC 16 Spin is a spin coater with no technical specifications on record.

The Tegal 415 is a plasma asher used in semiconductor processing.

The CEE 100 is a spin coater with a listed power specification of 115 volts and 800 watts.

The SVG 86 is a coater/developer with a track 1 sender-coat-receiver configuration and a track 2 sender-developer-receiver configuration.

The EV Group 120 Automated Coater Processing System is an automated coater for 6-inch and 8-inch wafers, built in 2015 and requiring 50/60 Hz, 3-phase, 4-wire plus ground power.

The PVA TePla 300 is a high-frequency plasma etch tool used for photoresist stripping, wafer surface cleaning, and hydrophilic surface enhancement.

The Lam/Novellus/Gasonics Aura 3010 is an asher used for photoresist removal in semiconductor manufacturing.

The Tegal T915 is a resist asher (asher) for semiconductor wafer processing.

The Laurell 750 Series is a spin coater line for spin coating applications.

Laurell WS-650-23B is a 650 Series spin coater with a maximum substrate size of ø150mm (5" × 5") and a maximum speed of 12,000 rpm.

The Laurell WS-650-8B is a spin coater in the 650 Series with a maximum substrate size of ø200mm (7" x 7") and a maximum speed of 12,000 rpm.

The Laurell WS-650-15B is a spin coater in the 650 Series.

The Laurell EDC-650-23B is an EDC System spin coater from the 650 Series, supporting substrates up to 150mm diameter and spin speeds up to 12,000 rpm.

The Laurell EDC-650-8B is an EDC System 650 Series spin coater with a maximum substrate size of 200mm (7" x 7").

The Laurell WS-650-23 B is a 650-series spin coater. The Laurell WS-650-23 B has a maximum substrate size of ø 150mm (5" x 5") and a maximum speed of 12000 rpm.

The Laurell WS-650-8 B is a 650-series spin coater with a maximum substrate size of 200mm (7" x 7") and a maximum speed of 12000 rpm.

The Laurell EDC-650-23 B is an EDC System 650-series spin coater with a maximum substrate size of ø 150mm (5" × 5") and a maximum speed of 12000 rpm.

The Laurell EDC-650-8 B is an EDC System 650-series spin coater with a maximum substrate size of ø 200mm (7" × 7") and a maximum speed of 12000 rpm.

Laurell EDC-650-15 B is an EDC System 650-series spin coater with a maximum substrate size of 300mm (9" x 9").

The Laurell H6-23 B is a Spin Coater in the 650-series. The Laurell H6-23 B accepts a maximum substrate size of ø 150mm (5" × 5") and is rated to 12000 rpm.

The Laurell H6-8 B is a spin coater in the 650-series with a maximum substrate size of 200mm (7" x 7"), a maximum speed of 12000 rpm, and tabletop, in-deck, or on-deck mounting options.

The Laurell EDC-HL-23 B is an EDC System 650-series spin coater with a maximum substrate size of 150 mm (5" x 5") and a maximum speed of 12000 rpm.

Laurell EDC-HL-8 B is an EDC System 650-series spin coater with a maximum substrate size of 200mm (7" x 7").

The Laurell EDC-HL-15 B is an EDC™ System spin coater in the 650-series. The Laurell EDC-HL-15 B accepts a maximum substrate size of 300mm (9" x 9") and reaches 12000 rpm.

The Laurell Lz-23 B is a 650-series spin coater that accepts substrates up to 150mm (5×5 inches) and spins up to 12000 rpm.

The Laurell EDC-650-15B is an EDC System spin coater. The Laurell EDC-650-15B supports a maximum substrate size of 300 mm (9" x 9").

The Laurell WS-750-23 B is a 750-series spin coater that processes substrates up to 150mm (5" x 5") with a maximum speed of 12000 rpm and offers tabletop, in-deck, or on-deck mounting options.

The Laurell H6-15 B is a spin coater in the 650-series. The Laurell H6-15 B supports a maximum substrate size of 300mm (9" x 9") and a maximum speed of 12000 rpm.

The Lam / Novellus / Gasonics L 3300 is an asher for 6-inch wafers.

The Tegal 515 is a plasma asher with an aluminum chamber for wafers up to 5 inches.

The SCREEN RF 3 S is a coater/developer for semiconductor wafer processing.

The Laurell WS-650-15 B is a 650-series spin coater for resist processing that accommodates up to 300mm wafers and reaches 12,000 RPM.

The Tokyo Electron Act 8 is a coater/developer system for 8-inch wafers.

The Tokyo Electron Mark VIII is a photoresist developer and coater system used in semiconductor manufacturing.