Fab Operation
Process development, packaging evaluation, and failure analysis
Flexible R&D labs for semiconductor process and device prototyping, advanced packaging development, and equipment qualification or failure analysis.
Wet Processing / Clean
Surface preparation is required between experimental process steps
The SUSS AS 8 Spray Coater is a semi-automatic spray coater for substrates up to 200mm or 300mm in diameter and square substrates up to 6 inches edge length.
The Glen/YES 1000FP is a plasma cleaning system designed to accept a range of shelf sizes for changing flat panel industry needs.
Etch
Etch development should be paired with profile metrology
The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.
The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.
Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.
The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.
The Oxford NGP80 RIE is a plasma etch system located in room W1-062.
Thermal / Diffusion
Anneal and cure experiments close the material process loop
The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.
The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.
YES-3TA is a Vacuum Bake / Vapor Prime system in the YES Vacuum Bake/Vapor Prime product line, with capacity for 8 cassettes of 4-inch wafers or 1 cassette of 5-8 inch wafers.
The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.
The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.
Spin coater
Flexible resist coating supports short R&D runs
The Laurell EDC-HL-15 B is a 650-series EDC spin processor that accommodates up to 300 mm wafers and 9" × 9" substrates.
The Laurell Lz-23 B is a compact 650-series spin coater that accommodates up to 150 mm wafers and 5 in × 5 in substrates.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell H6-23 is a compact HL Series spin coater for wafers and substrates, with a maximum rotational speed of 12,000 RPM.
The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.
Lithography
Patterning pairs with resist coating and post-process inspection
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.
The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.
The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.
Deposition
Film development and interface experiments drive the process loop
The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.
The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.
The Applied Materials Producer III is a chemical vapor deposition (CVD) system.
Dicing & Grinding
Cross-section preparation pairs grinding and polishing with imaging
The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.
The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.
The Accretech ACS 100 A is a cleaning after dicer system used in semiconductor dicing and grinding operations.
The Takatori MWS 610 SD is a wire saw for dicing applications, introduced in 2017.
The Disco DAD 3350 is an automatic dicing saw.
Metrology & Inspection
Characterization closes the loop on dimensional, film, and defect experiments
The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.
The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.
The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.
The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.
The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.
Packaging & Bonding
Handling fixtures and temporary attach protect thin panels and wafers
MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.
The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.
The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.
The West Bond K 1200 P is a semiconductor manufacturing equipment unit cataloged under asset number 136359.
The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.
Test & Probe
Electrical characterization validates prototype device behavior
The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.
The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.
The Keysight MSOX 4154 A is a mixed signal oscilloscope with 1.5 GHz bandwidth, 5 GSa/s sampling rate, and 4 channels.
Keysight / Agilent M 9037 A is a PXIe embedded controller.
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